 |
multilayer circuits
up to 6 layers |
technology of realization |
 |
BlackHole Metalization
Galvanic MacDermid
Press Laufferprase
basic laminate FR4
ISOLA |
| thickness of the copper foil |
thickness at the end |
35 µm
50 µm
|
1,00 mm
1,55 mm
2,00 mm
2,50 mm
others |
| max size:
|
250x350 mm |
| min hole diameter:
|
0,20 mm |
| min width of paths:
|
6 milsów |
| types of coating |
HAL PbSn
HAL Sn (Pb-free, lead-free)
Immersion and galvanic gold
Screen-print
Graphite layer
|
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